OVERVIEW

American Probe & Technologies has introduced the HC-6000 series of thermal chucks to provide accurate thermal control and surface uniformity required by the Semiconductor Industry.  With the heated chuck optimized for DC parametric or CV testing, APT has several configurations to meet your specific test application.

APT's heated wafer chuck incorporates a DC powered heater cartridge with cooling port designed for lower elec­trical noise output than its AC counterpart. The heater element is positioned within the cartridge assembly to provide excellent temperature uniformity across the entire chuck.  The chuck con­struction is from the high­est quality and density of Gold Plated (Optional finishes available) alumi­num, machined and ground to a surface flat­ness of better than ±.001". Vacuum rings secure the wafer or device, maintaining optimum heat transference and minimal device temperature variances.  From a basic heated wafer chuck, to a complete heated and cooled system with
 

 Rapid Fluid Assisted Cooling to ambient or sub-ambient tem­peratures. Available op­tions al­low the user to choose the necessary com­po­nents to configure a customized thermal solution. Op­tional isolation and shielding configurations allow for improved DC parametric testing performance with lower guarded capacitance.

CONTROLLER HIGHLIGHTS

The system controller is a microprocessor based unit with a continuous dual LED display of both Set and Monitored stage  tempera­tures.  The DC power supply is a patented proportional power for true linear DC output of heater voltages.  This allows very low measurement tests and increased thermo uniformity and mechanical stability of chuck growth.  The sensors utilized are deter­mined by the desired temperature range and accuracy required.  RTd and thermocouple sensors with a wide operation range and accuracy of <1°C are most commonly used .